6.9 Equipotential bonding

等电位连接

Item No 项目编号	Description 描述
1	Power supply unit for the CPU module *) CPU模板的电源单元
2	Fuse for the CPU module CPU模板的保险
3	Power supply unit for the I/O modules *) IO模板的电源
4	Fuse for the I/O modules * IO模板的保险
5	Fuses for the relay output contacts see module description 继电器输出连接保险看模板描述
6	0V rail (signal reference potential) 0V排（信号参考电位）
7	Earthing of the 0V rail 0V接地排
8	Switch cabinet earthing 开关柜接地
9	Equipotential bonding line between the switch cabinets, if applicable, at least 16 mm2 开关柜之间的等电位连接线，如果适用，至少16mm2
10	Cable shield earthing 电缆屏蔽接地
*) The use of a common power supply unit is also possible. 也可能是用一个共同的电源装置

 

• Install sufficiently dimensioned equipotential bonding lines if high potential differences between the system components are present or expected to occur with your specific application
• 如果系统组件之间存在，或者预计在特定应用中存在高电位差，安装尺寸足够大的等电位连接线。
• The impedance of the equipotential bonding line should amount to maximum 10% of the shield impedance of shielded signal lines between the same points.
• 等电位键合线的阻抗应达到相同点之间屏蔽信号线屏蔽阻抗的最大10%
• The cross-section of the equipotential bonding line must be rated for the maximum compensating current. Experience has shown that a cross-section of 16 mm² is usually sufficient
• 等电位键合线横截面的额定电流必须达到最大补偿电流。经验表明，16mm²的横截面通常就足够了
• Equipotential bonding and shielded signal cables should be laid as close as possible to each other to prevent the formation of inductive loops and the risk of interference coupling
• 等电位键合和屏蔽信号电缆应尽量靠近敷设，防止形成感应回路和干扰耦合的危险
• Ensure low-impedance connection between equipotential bonding lines and PE.
• 确保等电位键合线与PE之间的低阻抗连接